Advanced Machine Solutions for Advancing Technologies of High-Tech Industries
Surfacing:
Fine Grinding, Lapping and Polishing
Slicing:
Diamond Wire Saws
Advanced Machine Solutions for Advancing Technologies
High-precision fine grinding, lapping and polishing, and diamond wire slicing for high-tech industries
SOMOS IWT is the leading manufacturer of:
- Lapping and polishing machines
- Diamond wire saws
- Tools and consumables
- Contract manufacturing
Precision Optics • Silicon Carbide • Semiconductor • Crystals • Ceramics • Sapphire • Electronics
Lapping and Polishing
Equipment and Technology
Double-side, planetary lapping, and polishing fine grinding machines
The industry's most precise lapping and polishing equipment.
SOMOS IWT has a very wide range of equipment consisting of "double-sided" and "single-sided" machine (plates with a diameter ranging from 220 to 2500 mm) for lapping and polishing and fine grinding. This equipment ensures flatness, parallelism, and a surfacing state that meets the most demanding criteria.
Diamond Wire
Equipment and Technology
Single and multi-wire saws
Efficient cutting with speed, precision, and material savings.
Able to perform cropping, shaping, and dicing with high speed and precision on the toughest and most fragile materials.
Our products are designed and manufactured in North America.